Panduit GB4B0612TPI-1, Copper Grounding Busbar 4 in. x 12 in. 1 Hole

Panduit StructuredGround™ GB4B0612TPI-1 is a pre-assembled grounding busbar designed to bond and ground network equipment in telecom and data center environments. Made from Copper with a Tin-Plated finish, it is designed to inhibit corrosion. This telecommunications main grounding busbar measures 12 in. x 4 in. with a 0.25 in. thickness and includes brackets and insulators attached to help speed installation. It meets BICSI/TIA-607-D and is UL Listed for Grounding and Bonding Equipment.

Panduit GB4B0612TPI-1 Technical Specs

Product Identification

Brand line	StructuredGround™
Product type	Grounding Busbar
Application	Telecom/Data Center
UPC	07498334540

Materials & Finish

Material	Copper
Finish/coating	Tin-Plated

Dimensions & Physical Specs

Overall length	12 in. (304.8 mm)
Overall width	4 in. (101.6 mm)
Overall height	2.75 in. (69.9 mm)
Overall thickness	0.25 in. (6.4 mm)
Cable size	0.25 in x 4.00 in x 12.00 in(DxWxL)

Hole & Stud Details

Stud hole size	7/16 in. (11.2 mm)
Hole - qtysize	0.44 in.
Hole quantity total	18

Compliance & Certifications

Standards met	BICSI/TIA-607-D, cULus Listed for Grounding and Bonding Equipment

Panduit GB4B0612TPI-1 Applications

• Supports bonding and grounding of network equipment in telecom and data center environments.
• Creates an organized grounding point as part of a telecommunications main grounding busbar setup.
• Works well in installations where a pre-assembled busbar with brackets and insulators can help speed mounting and setup.

Shipping & Availability

Standard package quantity	1
Standard package volume (cu. ft.)	0.0069
Standard carton quantity	0
Standard carton volume (cu. ft.)	0.0000

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